Members

• Semiconductor Materi, Process and Devices
• Process Integration of Logic, Memory, Analog (Power) Devices including “More Than Moore” and “More Moore”
• Atomic Layer Deposition (in-situ electrical and materials characterization, 1-2-3D nanostructure applications, selective deposition and atomic layer etching)
• Nanomaterials and Precise Process for NT, IT, ET and BT Applications

• Electronic materials with an emphasis on dielectrics (low-K, high-K, and gate dielectrics other than SiO2)
• Display technology
• Materials characterization
• Nuclear chemistry
• Passivation and Release for Microelectromechanical System (MEMS) Devices
• Low Temperature Processing for Flexible Electronics
• High-k Gate Dielectrics and Metal Gates
• Micro Gas Analysis

• Heterogeneous materials integration by wafer bonding
• Fabrication and characterization of various functional nanostructures for applications in nano-electronics, power electronics, energy, electrochemical and bio-devices
• Atomic scale characterization of low dimensional materials
• In-situ TEM study of electrochemical and biological systems
• Nanopore-based sequencing of biomolecules
• Nano 3D Printing technology
• Fabrication of 3D nanostructures for nano-robots
• Virtual Reality Contents for education and research

• Nanomaterials for renewable energy application
• High-k gate stack technology

Surface, Interface, materials and integration issues for advanced devices including:

• Gate dielectrics
• Gate electrodes
• Contacts
• Nanoelectronics

• Materials and Devices for Flexible Electronics
• The development, modeling and physical, electrical and chemical characterization of new materials and devices for flexible electronics